On the occasion of the renovation in August, there was good news in the field of domestic semiconductor packaging equipment - the wafer-level vacuum film system independently developed by Nilizheng was officially delivered to the industry's flagship customer! This not only marks a solid step for the company on the road of "making Nilizheng for China's core", but also highlights the breakthrough progress of domestic high-end packaging equipment in the core process.

directly hits the pain point: cracking the "bubble" dilemma of advanced packaging

In the pursuit of advanced packaging fields with higher integration and smaller line widths (such as Fan-Out, 2.5D/3D IC, Chiplet), wafer-level film is the key process ahead. The traditional atmospheric pressure film is easy to introduce micro bubbles, resulting in defects in subsequent processes (such as exposure, etching, electroplating), which seriously restricts product yield and reliability. With its deep accumulation in the field of advanced packaging defoaming technology, Nilizhichuang has accurately benchmarked the international frontier and launched a revolutionary vacuum film solution.